The MD810-50M4T1.5G200 is a high-precision multi-axis servo drive from INOVANCE’s flagship MD810 series, rated at 50A with support for up to 4 servo axes in a single compact unit with 220V class three-phase input. Designed for applications demanding superior motion accuracy and ultra-smooth trajectory control, this drive combines advanced EtherCAT real-time communication with high-resolution 24-bit encoder feedback and enhanced vibration suppression algorithms. It is ideally suited for semiconductor wafer handling, high-precision laser processing, electronic component placement, medical device manufacturing, precision metrology equipment and laboratory automation where micron-level positioning accuracy, minimal velocity ripple and flawless multi-axis coordination are critical quality requirements.
| Product Type | High-Precision Multi-Axis Servo Drive System |
|---|---|
| Model Number | MD810-50M4T1.5G200 |
| Rated Current | 50 A |
| Peak Current | 125 A (250% Overload) |
| Number of Axes | Up to 4 Axes (Modular Expandable) |
| Input Voltage | Three-Phase 220 V AC |
| DC Bus Voltage | 310 V DC (Nominal) |
| Control Mode | Position, Speed, Torque, CSP/CSV/CST (EtherCAT) |
| Communication | EtherCAT (CoE), CANopen, RS485 Modbus |
| Encoder Support | 24-bit Absolute, Incremental, EnDat 2.2, BiSS-C |
| Positioning Accuracy | ±1 Encoder Pulse (Sub-Micron with Linear Encoder) |
| Speed Control Range | 1:5000 |
| Frequency Response | 3.0 kHz (Speed Loop Bandwidth) |
| Notch Filters | 5-Channel Adaptive Notch + Auto Resonance Detection |
| Safety Functions | STO (SIL3 / PLe), SS1, SS2 |
| Protection Class | IP20 (Cabinet Mounting) |
| Cooling Method | Low-Noise Forced Air Cooling |
| Ambient Temperature | 0°C to +55°C (Derating Above 45°C) |
| Certification | CE, RoHS, SIL3 / PLe Functional Safety |
Semiconductor Wafer Handling & Inspection Systems, High-Precision Laser Cutting & Marking Machines, SMT Pick-and-Place & Electronic Assembly, Medical Device & Laboratory Automation, Precision Metrology & 3D Coordinate Measurement, Optical Lens Grinding & Polishing Equipment, Printed Circuit Board (PCB) Drilling & Routing, Precision Dispensing & Adhesive Bonding Systems.