Mitsubishi Electric Launches Compact DIPIPM™ Series: 47% Smaller Footprint for Compact, High-Efficiency Inverters

Tokyo, September 11, 2025 — Mitsubishi Electric Corporation (TOKYO: 6503) has officially announced the launch of its new Compact DIPIPM™ series of power semiconductor modules, designed specifically for consumer and industrial equipment such as packaged air conditioners, heat pump heating and hot water systems. Sample shipments will begin on September 22, 2025, marking a significant leap forward in compact, energy-efficient power conversion technology.

The new series includes two models: PSS30SF1F6 (30A / 600V) and PSS50SF1F6 (50A / 600V). By integrating advanced Reverse-Conducting Insulated-Gate Bipolar Transistors (RC-IGBTs), the module’s footprint is reduced to approximately 53% of the company’s conventional Mini DIPIPM Ver.7 series—a 47% reduction in package area—enabling far more compact inverter substrates and system designs.

• Ultra-Compact Design: 47% smaller footprint than previous generations, ideal for space-constrained applications like residential and light commercial HVAC systems.
• High Efficiency & Reliability: Optimized RC-IGBT technology minimizes power loss, while an extended operating temperature range (-40°C to +125°C) ensures stable performance in harsh environments.
• Simplified Manufacturing: Reduced size and weight streamline assembly, lower material costs, and support automated production lines for mass scalability.
• Drop-In Compatibility: Maintains compatibility with existing DIPIPM mounting and circuit layouts, allowing manufacturers to upgrade without extensive redesign.

The Compact DIPIPM™ series is tailored for:

• Packaged air conditioners (residential & light commercial)
• Heat pump heating and hot water systems
• Small industrial inverters and motor drives
• Consumer electronics requiring high-efficiency power conversion

Samples of the PSS30SF1F6 and PSS50SF1F6 modules will be available worldwide starting September 22, 2025. Mitsubishi Electric will showcase the new series at PCIM Asia 2025 (Shanghai, September 24–26), alongside other innovative power semiconductor solutions, including SiC modules and 8th-generation IGBTs.

As a leader in power semiconductors, Mitsubishi Electric continues to drive miniaturization and efficiency in power conversion systems. The Compact DIPIPM™ series addresses the growing demand for smaller, lighter, and more energy-efficient electronics, supporting global sustainability goals by reducing power consumption in everyday appliances and industrial equipment.